Advanced Packaging Engineer

Social network you want to login/join with: Job Title: Advanced Packaging Engineer Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer . The role involves driving device packaging projects and roadmaps, developing 2.5/3D advanced packaging solutions, and liaising with OSATs throughout the project lifecycle, including concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities. This position can be performed remotely. Required Skills: Strong semiconductor packaging experience and knowledge Knowledge of 2.5/3D advanced packaging solutions Excellent communication skills and team management abilities Experience liaising with OSATs Please contact Rachel Anderson for further details. J-18808-Ljbffr

Location: Pisa, Toscana, IT

Posted Date: 8/17/2025