Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Engineering Execution Manager, HIG High Bandwidth Memory (HBM) Join to apply for the Engineering Execution Manager, HIG High Bandwidth Memory (HBM) role at Micron Technology Engineering Execution Manager, HIG High Bandwidth Memory (HBM) 1 day ago Be among the first 25 applicants Join to apply for the Engineering Execution Manager, HIG High Bandwidth Memory (HBM) role at Micron Technology Get AI-powered advice on this job and more exclusive features. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end-to-end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on vertical integration and the collaboration of various engineering teams. As an Engineering Execution Lead/Manager in the HBM HIG organization, you will be responsible for guiding an HBM product through various phases, including concept, design, NPI, and HVM, by facilitating cross-functional lifecycle management. You will help build and maintain detailed development schedules and drive relevant tactical execution. You will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, analyzing issues and risks, and allocating resources to meet timelines and deliverables. Key Responsibilities Include, But Are Not Limited To Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations. Partner with Technology Development, Design, Process, APTD, PE, and Manufacturing teams to drive development progress and alignment. Collaborate with the PMO organization to build and maintain detailed development schedules and drive tactical execution from pre-silicon to HVM. Communicate regularly about development status, priorities, and challenges across the organization. Set and prioritize expectations across development activities based on milestones and stakeholder needs. Serve as a point of contact for the product, including task ownership and managing development documentation. Consolidate and provide inputs for hardware readiness and capacity planning to support engineering activities. Key Requirements Bachelor’s or Master’s degree in Electrical or Computer Engineering or related fields. 5 years of relevant experience in technical, manufacturing, or cross-functional team leadership. Excellent communication and presentation skills. Proficiency in data analysis, visualization, and tools like JIRA, Confluence, and project management software. An innovative mindset open to process and product improvements. About Micron Technology, Inc. We are a leader in memory and storage solutions, transforming how the world uses information. Our innovations fuel the data economy, enabling advances in AI and 5G applications across various domains. J-18808-Ljbffr

Location: Singapore, Michigan, SG

Posted Date: 7/15/2025